BS IEC 62047-27:2017
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
| Standard number: | BS IEC 62047-27:2017 |
| Pages: | 20 |
| Released: | 2020-07-22 |
| ISBN: | 978 0 580 89909 6 |
| Status: | Standard |
BS IEC 62047-27:2017: Semiconductor Devices - Micro-electromechanical Devices Bond Strength Test
Welcome to the comprehensive guide on the BS IEC 62047-27:2017 standard, a pivotal document for professionals in the semiconductor industry. This standard is essential for those involved in the design, testing, and manufacturing of micro-electromechanical devices (MEMS), specifically focusing on the bond strength test for glass frit bonded structures using micro-chevron-tests (MCT).
Overview of the Standard
The BS IEC 62047-27:2017 standard provides a detailed methodology for conducting bond strength tests on glass frit bonded structures. This is crucial for ensuring the reliability and durability of MEMS devices, which are increasingly used in a variety of applications, from consumer electronics to automotive systems.
Key Features
- Standard Number: BS IEC 62047-27:2017
- Pages: 20
- Released: 2020-07-22
- ISBN: 978 0 580 89909 6
- Status: Standard
Importance of Bond Strength Testing
Bond strength testing is a critical process in the development of MEMS devices. The integrity of the bond between different materials can significantly affect the performance and longevity of the device. The BS IEC 62047-27:2017 standard outlines the procedures for micro-chevron-tests (MCT), which are designed to accurately measure the bond strength of glass frit bonded structures.
Glass frit bonding is a popular technique used in MEMS fabrication due to its ability to create strong, hermetic seals. However, the quality of these bonds must be rigorously tested to ensure they meet the necessary performance standards. This standard provides the guidelines needed to perform these tests effectively.
Applications of the Standard
The BS IEC 62047-27:2017 standard is applicable to a wide range of industries that utilize MEMS technology. Some of the key sectors include:
- Consumer Electronics: MEMS devices are integral to the functionality of smartphones, tablets, and other personal electronic devices.
- Automotive Industry: MEMS sensors are used in various automotive applications, including airbag systems, tire pressure monitoring, and vehicle stability control.
- Medical Devices: The precision and reliability of MEMS technology make it ideal for use in medical diagnostics and monitoring equipment.
- Industrial Automation: MEMS devices are used in automation systems for monitoring and controlling industrial processes.
Benefits of Using the Standard
Adhering to the BS IEC 62047-27:2017 standard offers numerous benefits, including:
- Enhanced Reliability: By following the standardized testing procedures, manufacturers can ensure the reliability and durability of their MEMS devices.
- Quality Assurance: The standard provides a benchmark for quality, helping manufacturers maintain consistent product quality.
- Compliance: Meeting the requirements of this standard can help companies comply with industry regulations and standards.
- Competitive Advantage: Companies that adhere to recognized standards can gain a competitive edge by demonstrating their commitment to quality and reliability.
Conclusion
The BS IEC 62047-27:2017 standard is an essential resource for professionals in the semiconductor and MEMS industries. By providing a clear framework for bond strength testing, it helps ensure the performance and reliability of MEMS devices across various applications. Whether you are involved in design, testing, or manufacturing, this standard is a valuable tool for achieving excellence in your products.
For those looking to enhance their understanding and implementation of MEMS technology, the BS IEC 62047-27:2017 standard is an indispensable guide. Embrace the precision and reliability that this standard offers and take your MEMS devices to the next level of performance and quality.
BS IEC 62047-27:2017
This standard BS IEC 62047-27:2017 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
- 31.080.99 Other semiconductor devices
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.