BS IEC 62047-35:2019: A Comprehensive Standard for Semiconductor Devices

In the rapidly evolving world of technology, the demand for flexible and efficient semiconductor devices is ever-increasing. The BS IEC 62047-35:2019 standard is a pivotal document that addresses the testing methods of electrical characteristics under bending deformation for flexible electromechanical devices. Released on April 20, 2021, this standard is an essential resource for professionals in the semiconductor industry, ensuring that devices meet the rigorous demands of modern applications.

Key Features of BS IEC 62047-35:2019

• Standard Number: BS IEC 62047-35:2019
• Pages: 24
• Release Date: April 20, 2021
• ISBN: 978 0 580 99495 1
• Status: Standard

Understanding the Importance of This Standard

The BS IEC 62047-35:2019 standard is crucial for the development and testing of micro-electromechanical devices (MEMS). As technology advances, the need for devices that can withstand various physical stresses, such as bending, becomes more critical. This standard provides a detailed methodology for assessing the electrical characteristics of these devices when subjected to bending deformation, ensuring their reliability and performance in real-world applications.

Why Flexibility Matters

In today's tech-driven world, flexibility in electronic devices is not just a luxury but a necessity. From wearable technology to flexible displays, the ability of a device to bend and flex without compromising its functionality is a key factor in its design and application. The BS IEC 62047-35:2019 standard provides the framework for testing these capabilities, ensuring that devices can meet the demands of modern consumers and industries.

Applications of the Standard

This standard is applicable to a wide range of industries and technologies, including:

• Wearable Technology: Ensuring that smartwatches, fitness trackers, and other wearable devices maintain their performance under physical stress.
• Flexible Displays: Testing the durability and reliability of flexible screens used in smartphones, tablets, and other electronic devices.
• Medical Devices: Evaluating the performance of flexible medical sensors and devices that require bending and flexing during use.
• Automotive Industry: Assessing the reliability of flexible sensors and components used in modern vehicles.

Comprehensive Testing Methodology

The BS IEC 62047-35:2019 standard outlines a comprehensive testing methodology that includes:

• Preparation of Test Samples: Guidelines for preparing samples to ensure consistent and accurate testing results.
• Bending Deformation Testing: Detailed procedures for applying bending stress to devices and measuring their electrical characteristics.
• Data Analysis: Methods for analyzing test data to assess the performance and reliability of the devices under test.

Ensuring Quality and Reliability

By adhering to the BS IEC 62047-35:2019 standard, manufacturers and developers can ensure that their products meet the highest quality and reliability standards. This not only enhances the performance of the devices but also boosts consumer confidence in the products they use.

Benefits of Compliance

Compliance with this standard offers numerous benefits, including:

• Enhanced Product Performance: Ensuring that devices perform optimally under various conditions.
• Increased Market Competitiveness: Meeting industry standards can give companies a competitive edge in the market.
• Improved Consumer Trust: Products that comply with recognized standards are more likely to be trusted by consumers.

Conclusion

The BS IEC 62047-35:2019 standard is an indispensable tool for anyone involved in the design, development, and testing of flexible electromechanical devices. By providing a clear and detailed methodology for testing electrical characteristics under bending deformation, this standard ensures that devices are reliable, efficient, and ready to meet the challenges of modern technology. Whether you are a manufacturer, developer, or researcher, adhering to this standard is a step towards innovation and excellence in the semiconductor industry.

BS IEC 62047-35:2019

This standard BS IEC 62047-35:2019 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:

• 31.080.99 Other semiconductor devices

This part of IEC 62047 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 μm to 1 mm, but these are not limiting values. The test method is so designed as to bend devices in a quasi-static manner monotonically up to the maximum possible curvature, i.e. until the device is completely folded, so that the entire degradation behaviour of the electric property under bending deformation is obtained. This document is essential to estimate the safety margin under a certain bending deformation and indispensable for reliable design of the product employing these devices.