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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>BS IEC 62047-36:2019 Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
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immediate downloadReleased: 2019-04-24
BS IEC 62047-36:2019 Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

BS IEC 62047-36:2019

Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

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Standard number:BS IEC 62047-36:2019
Pages:20
Released:2019-04-24
ISBN:978 0 580 99118 9
Status:Standard
DESCRIPTION

BS IEC 62047-36:2019


This standard BS IEC 62047-36:2019 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.140 Piezoelectric devices
  • 31.080.99 Other semiconductor devices

This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used as actuators.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.