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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS IEC 62047-37:2020 Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
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immediate downloadReleased: 2023-04-05
BS IEC 62047-37:2020 Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application

BS IEC 62047-37:2020

Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application

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Standard number:BS IEC 62047-37:2020
Pages:20
Released:2023-04-05
ISBN:978 0 539 02533 0
Status:Standard

BS IEC 62047-37:2020 Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application

Introducing the BS IEC 62047-37:2020, a comprehensive guide to environmental test methods for Micro-Electromechanical Systems (MEMS) piezoelectric thin films for sensor applications. This standard is a must-have for professionals in the semiconductor industry, providing a detailed framework for testing and evaluating the environmental performance of MEMS piezoelectric thin films.

Released on April 5, 2023, this standard is the latest in the series, reflecting the most recent advancements and best practices in the field. With a total of 20 pages, it offers a concise yet thorough overview of the subject matter, making it an invaluable resource for both beginners and seasoned professionals.

Key Features

The BS IEC 62047-37:2020 standard provides a comprehensive set of environmental test methods for MEMS piezoelectric thin films. These methods are designed to assess the performance of these films under various environmental conditions, ensuring their reliability and durability in real-world applications.

Some of the key features of this standard include:

  • Standard number: BS IEC 62047-37:2020
  • Pages: 20
  • Released: 2023-04-05
  • ISBN: 978 0 539 02533 0
  • Name: Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
  • Status: Standard

Why Choose BS IEC 62047-37:2020?

The BS IEC 62047-37:2020 standard is a trusted resource in the semiconductor industry. It is recognized for its rigorous approach to testing and its commitment to promoting high standards of quality and safety. By following the guidelines outlined in this standard, professionals can ensure that their MEMS piezoelectric thin films meet the highest standards of performance and reliability.

Furthermore, this standard is backed by the International Electrotechnical Commission (IEC), a leading global organization that develops and publishes international standards for all electrical, electronic and related technologies. This ensures that the information contained within is accurate, up-to-date, and aligned with global best practices.

Conclusion

In conclusion, the BS IEC 62047-37:2020 standard is an essential tool for anyone involved in the design, production, or testing of MEMS piezoelectric thin films. It provides a clear and comprehensive guide to environmental testing methods, helping to ensure the highest levels of performance and reliability. Whether you're a seasoned professional or a newcomer to the field, this standard is a valuable addition to your professional toolkit.

Don't miss out on this opportunity to stay ahead of the curve in the rapidly evolving semiconductor industry. Order your copy of the BS IEC 62047-37:2020 standard today!

DESCRIPTION

BS IEC 62047-37:2020


This standard BS IEC 62047-37:2020 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
  • 31.080.99 Other semiconductor devices
  • 31.140 Piezoelectric devices
IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.