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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS IEC 62899-202-5:2018 Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
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immediate downloadReleased: 2018-10-09
BS IEC 62899-202-5:2018 Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

BS IEC 62899-202-5:2018

Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

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Standard number:BS IEC 62899-202-5:2018
Pages:18
Released:2018-10-09
ISBN:978 0 580 96621 7
Status:Standard
DESCRIPTION

BS IEC 62899-202-5:2018


This standard BS IEC 62899-202-5:2018 Printed electronics is classified in these ICS categories:
  • 87.080 Inks. Printing inks
  • 31.180 Printed circuits and boards
IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

 


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