BS IEC 62899-202-7:2021 - Printed Electronics Materials

Welcome to the future of electronics with the BS IEC 62899-202-7:2021 standard, a pivotal document that sets the benchmark for measuring the peel strength of printed layers on flexible substrates using the 90° peel method. This standard is an essential resource for professionals in the field of printed electronics, providing comprehensive guidelines to ensure the reliability and durability of printed films.

Overview

The BS IEC 62899-202-7:2021 standard is a crucial document for anyone involved in the development, testing, and application of printed electronics. Released on March 11, 2021, this standard provides a detailed methodology for assessing the peel strength of printed layers, which is a critical factor in determining the performance and longevity of flexible electronic devices.

Key Features

• Standard Number: BS IEC 62899-202-7:2021
• Pages: 16
• Release Date: March 11, 2021
• ISBN: 978 0 580 52003 7
• Status: Standard

Why This Standard Matters

In the rapidly evolving world of printed electronics, ensuring the integrity and performance of printed films is paramount. The BS IEC 62899-202-7:2021 standard provides a reliable method for measuring peel strength, which is essential for:

• Quality Assurance: Ensuring that printed layers adhere properly to flexible substrates, preventing delamination and failure in electronic devices.
• Product Development: Assisting engineers and designers in selecting materials and processes that enhance the durability and functionality of printed electronics.
• Research and Innovation: Facilitating advancements in material science and engineering by providing a standardized method for evaluating new materials and technologies.

Applications

The methodologies outlined in this standard are applicable across a wide range of industries and applications, including:

• Flexible Displays: Ensuring the reliability of displays that can bend and flex without losing functionality.
• Wearable Electronics: Enhancing the durability of electronic components integrated into clothing and accessories.
• Smart Packaging: Improving the performance of packaging that incorporates electronic features such as sensors and indicators.
• Medical Devices: Ensuring the safety and effectiveness of flexible electronic components used in medical applications.

Technical Insights

The 90° peel method described in the BS IEC 62899-202-7:2021 standard is a precise and reliable technique for measuring the adhesion strength of printed layers. This method involves peeling a printed layer from its substrate at a 90-degree angle, providing a clear and quantifiable measure of peel strength. This data is crucial for:

• Material Selection: Helping manufacturers choose the best materials for their specific applications based on adhesion properties.
• Process Optimization: Allowing engineers to refine printing processes to achieve optimal adhesion and performance.
• Quality Control: Providing a standardized test to ensure consistent product quality across different batches and production runs.

Conclusion

The BS IEC 62899-202-7:2021 standard is an indispensable tool for professionals in the field of printed electronics. By providing a standardized method for measuring peel strength, this document helps ensure the reliability, durability, and performance of flexible electronic devices. Whether you are involved in research, development, or production, this standard is a valuable resource that can help you achieve excellence in your work.

Embrace the future of electronics with confidence, knowing that your products meet the highest standards of quality and performance with the BS IEC 62899-202-7:2021 standard.

BS IEC 62899-202-7:2021

• 29.035.01 Insulating materials in general
• 31.180 Printed circuits and boards

This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.