Integrated circuits. Three dimensional integrated circuits Terminology
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Standard number:
BS IEC 63011-1:2018
Pages:
16
Released:
2019-01-24
ISBN:
978 0 580 96278 3
Status:
Standard
DESCRIPTION
BS IEC 63011-1:2018
This standard BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:
31.200 Integrated circuits. Microelectronics
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.