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Homepage>BS Standards>31 ELECTRONICS>31.200 Integrated circuits. Microelectronics>BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits Terminology
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immediate downloadReleased: 2019-01-24
BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits Terminology

BS IEC 63011-1:2018

Integrated circuits. Three dimensional integrated circuits Terminology

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Standard number:BS IEC 63011-1:2018
Pages:16
Released:2019-01-24
ISBN:978 0 580 96278 3
Status:Standard
DESCRIPTION

BS IEC 63011-1:2018


This standard BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:
  • 31.200 Integrated circuits. Microelectronics
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
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