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Homepage>BS Standards>31 ELECTRONICS>31.200 Integrated circuits. Microelectronics>BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
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immediate downloadReleased: 2019-01-24
BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect

BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect

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Standard number:BS IEC 63011-2:2018
Pages:18
Released:2019-01-24
ISBN:978 0 580 97375 8
Status:Standard
DESCRIPTION

BS IEC 63011-2:2018


This standard BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:
  • 31.200 Integrated circuits. Microelectronics
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
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