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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS IEC 63068-3:2020 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method for defects using photoluminescence
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BS IEC 63068-3:2020 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method for defects using photoluminescence

BS IEC 63068-3:2020

Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method for defects using photoluminescence

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Standard number:BS IEC 63068-3:2020
Pages:28
Released:2020-07-24
ISBN:978 0 539 02136 3
Status:Standard
BS IEC 63068-3:2020 - Semiconductor Devices Standard

BS IEC 63068-3:2020: Semiconductor Devices Standard

Welcome to the world of advanced semiconductor technology with the BS IEC 63068-3:2020 standard. This comprehensive document is an essential resource for professionals in the semiconductor industry, providing critical guidelines for the non-destructive recognition of defects in silicon carbide homoepitaxial wafers used in power devices. Released on July 24, 2020, this standard is a cornerstone for ensuring quality and reliability in semiconductor manufacturing.

Overview

The BS IEC 63068-3:2020 standard is a meticulously crafted document that spans 28 pages. It is designed to offer a detailed methodology for identifying defects in silicon carbide (SiC) wafers, which are pivotal in the production of power devices. The standard employs photoluminescence as a test method, a non-destructive technique that allows for the precise detection of defects without compromising the integrity of the wafer.

Key Features

  • Standard Number: BS IEC 63068-3:2020
  • ISBN: 978 0 539 02136 3
  • Status: Standard
  • Release Date: July 24, 2020
  • Pages: 28

Importance of Silicon Carbide in Power Devices

Silicon carbide (SiC) is a revolutionary material in the field of power electronics. Its superior properties, such as high thermal conductivity, high electric field breakdown strength, and high-temperature operation, make it an ideal choice for power devices. The use of SiC in power devices leads to increased efficiency, reduced size, and improved performance, which are critical factors in applications ranging from electric vehicles to renewable energy systems.

Photoluminescence: A Non-Destructive Testing Method

The BS IEC 63068-3:2020 standard emphasizes the use of photoluminescence as a non-destructive testing method. Photoluminescence is a powerful technique that involves the emission of light from a material after it has absorbed photons. This method is particularly effective in identifying defects in semiconductor materials, as it provides a high-resolution map of the wafer's defect landscape without causing any damage.

Benefits of Using BS IEC 63068-3:2020

Adopting the BS IEC 63068-3:2020 standard offers numerous benefits to semiconductor manufacturers and researchers:

  • Enhanced Quality Control: By providing a reliable method for defect detection, this standard helps ensure the production of high-quality wafers, leading to more reliable power devices.
  • Cost Efficiency: Non-destructive testing methods like photoluminescence reduce the need for destructive testing, saving both time and resources.
  • Improved Performance: Identifying and mitigating defects early in the manufacturing process leads to devices with superior performance and longevity.
  • Compliance and Standardization: Following this internationally recognized standard ensures compliance with industry best practices and facilitates global trade and collaboration.

Applications

The guidelines set forth in the BS IEC 63068-3:2020 standard are applicable across a wide range of industries and applications, including:

  • Automotive: Enhancing the performance and reliability of electric vehicle powertrains.
  • Renewable Energy: Improving the efficiency of solar inverters and wind turbine converters.
  • Industrial Electronics: Ensuring the robustness of power supplies and motor drives.
  • Telecommunications: Supporting the development of high-frequency and high-power communication devices.

Conclusion

The BS IEC 63068-3:2020 standard is an indispensable tool for anyone involved in the semiconductor industry. Its focus on non-destructive defect recognition in silicon carbide wafers ensures that power devices meet the highest standards of quality and performance. By integrating this standard into your processes, you can achieve greater efficiency, reliability, and innovation in your semiconductor applications.

Embrace the future of semiconductor technology with the BS IEC 63068-3:2020 standard and stay ahead in the competitive landscape of power electronics.

DESCRIPTION

BS IEC 63068-3:2020


This standard BS IEC 63068-3:2020 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices
  • 31.080.01 Semiconductor devices in general
IEC 63068-3:2020 provides definitions and guidance in use of photoluminescence for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies photoluminescence images and emission spectra to enable the detection and categorization of the defects in SiC homoepitaxial wafers.