BS ISO 21859:2019 - Fine Ceramics Test Method for Plasma Resistance

In the ever-evolving world of semiconductor manufacturing, the need for precision, durability, and reliability is paramount. The BS ISO 21859:2019 standard is a critical resource for professionals in the field, providing a comprehensive test method for evaluating the plasma resistance of ceramic components used in semiconductor manufacturing equipment.

Overview of BS ISO 21859:2019

This standard, released on June 19, 2019, is a testament to the advancements in fine ceramics, also known as advanced ceramics or advanced technical ceramics. With a total of 12 pages, it offers a detailed methodology for assessing the plasma resistance of ceramic components, ensuring that they meet the rigorous demands of semiconductor manufacturing processes.

Key Features

• Standard Number: BS ISO 21859:2019
• Pages: 12
• Release Date: 2019-06-19
• ISBN: 978 0 580 96201 1
• Status: Standard

Importance of Plasma Resistance in Semiconductor Manufacturing

In semiconductor manufacturing, the components are often exposed to harsh plasma environments. This exposure can lead to wear and degradation, affecting the performance and longevity of the equipment. The BS ISO 21859:2019 standard provides a reliable test method to evaluate the plasma resistance of ceramic components, ensuring they can withstand these challenging conditions.

Why Choose Fine Ceramics?

Fine ceramics, or advanced ceramics, are known for their exceptional properties, including high thermal stability, chemical resistance, and mechanical strength. These characteristics make them ideal for use in semiconductor manufacturing equipment, where precision and durability are crucial.

Benefits of Using BS ISO 21859:2019

Adopting the BS ISO 21859:2019 standard offers several benefits for manufacturers and engineers:

• Enhanced Reliability: By ensuring that ceramic components meet the required plasma resistance standards, manufacturers can enhance the reliability and performance of their equipment.
• Increased Longevity: Components that resist plasma degradation have a longer lifespan, reducing the need for frequent replacements and maintenance.
• Cost Efficiency: With improved durability and reduced maintenance needs, manufacturers can achieve cost savings over the long term.
• Compliance and Quality Assurance: Adhering to international standards like BS ISO 21859:2019 demonstrates a commitment to quality and compliance, enhancing the reputation of manufacturers in the global market.

Applications in the Semiconductor Industry

The BS ISO 21859:2019 standard is particularly relevant for manufacturers of semiconductor equipment, including:

• Etching and deposition equipment
• Plasma-enhanced chemical vapor deposition (PECVD) systems
• Ion implantation machines
• Other plasma-based processing equipment

By ensuring that ceramic components used in these applications meet the required plasma resistance standards, manufacturers can improve the overall efficiency and effectiveness of their equipment.

Conclusion

The BS ISO 21859:2019 standard is an essential tool for professionals in the semiconductor manufacturing industry. By providing a reliable test method for evaluating the plasma resistance of ceramic components, it helps ensure that equipment can withstand the demanding conditions of modern manufacturing processes. With its focus on quality, reliability, and durability, this standard is a valuable resource for manufacturers looking to enhance the performance and longevity of their products.

Invest in the future of your semiconductor manufacturing processes by adopting the BS ISO 21859:2019 standard, and ensure that your equipment is built to last in the face of challenging plasma environments.

BS ISO 21859:2019

This standard BS ISO 21859:2019 Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for plasma resistance of ceramic components in semiconductor manufacturing equipment is classified in these ICS categories:

• 81.060.30 Advanced ceramics

This document specifies a test method for plasma resistance of ceramic components in semiconductor manufacturing equipment. It is applicable to ceramic components of plasma-resistant components in dry etching chambers used in semiconductor manufacturing.