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01.100.25 Electrical and electronics engineering drawings

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BS EN 60191-6-8:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)

Released: 2001-11-16

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160.80 EUR

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16.08 EUR

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48.24 EUR

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160.80 EUR

BS EN 60848:2013
GRAFCET specification language for sequential function charts

Released: 2013-07-31

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367.20 EUR

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36.72 EUR

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110.16 EUR

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367.20 EUR

BS EN 60139:2001
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges

Released: 2001-08-15

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309.60 EUR

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30.96 EUR

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92.88 EUR

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309.60 EUR

BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)

Released: 2001-11-15

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48.24 EUR

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BS EN 60191-6-3:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

Released: 2001-05-15

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189.60 EUR

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18.96 EUR

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56.88 EUR

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189.60 EUR

BS EN 60191-6-17:2011
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Released: 2011-06-30

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264.00 EUR

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26.40 EUR

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79.20 EUR

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264.00 EUR

BS EN 60191-3:2000
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits

Released: 2000-06-15

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367.20 EUR

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36.72 EUR

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110.16 EUR

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BS EN 60191-6-1:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals

Released: 2002-03-29

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160.80 EUR

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16.08 EUR

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48.24 EUR

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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions

Released: 2020-04-02

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396.00 EUR

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39.60 EUR

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118.80 EUR

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396.00 EUR

BS EN 60191-6-12:2011
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

Released: 2011-08-31

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264.00 EUR

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26.40 EUR

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79.20 EUR

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264.00 EUR

BS EN 60191-6-6:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA)

Released: 2001-09-05

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189.60 EUR

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18.96 EUR

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56.88 EUR

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189.60 EUR

BS EN 60191-6-2:2002
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Released: 2003-03-04

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160.80 EUR

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16.08 EUR

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48.24 EUR

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160.80 EUR