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31.080.01 Semiconductor devices in general
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Released: 2007-07-31
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151.20 EUR
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15.12 EUR
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45.36 EUR
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151.20 EUR
BS EN 60749-23:2004+A1:2011
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Released: 2011-06-30
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151.20 EUR
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15.12 EUR
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45.36 EUR
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151.20 EUR
BS EN 60749-27:2006+A1:2012
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Released: 2013-01-31
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180.00 EUR
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18.00 EUR
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54.00 EUR
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180.00 EUR
BS EN 60749-21:2011
Semiconductor devices. Mechanical and climatic test methods Solderability
Semiconductor devices. Mechanical and climatic test methods Solderability
Released: 2011-08-31
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249.60 EUR
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24.96 EUR
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74.88 EUR
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249.60 EUR
PD ES 59008-6-2:2001
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Released: 2001-06-15
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249.60 EUR
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24.96 EUR
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74.88 EUR
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249.60 EUR
BS EN 60749-31:2003
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Released: 2003-07-04
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151.20 EUR
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15.12 EUR
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45.36 EUR
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151.20 EUR
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249.60 EUR
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24.96 EUR
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74.88 EUR
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249.60 EUR
PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Released: 2001-12-05
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151.20 EUR
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45.36 EUR
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BS EN 60749-35:2006
Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
Released: 2006-11-30
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249.60 EUR
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24.96 EUR
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74.88 EUR
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249.60 EUR
BS EN 60749-44:2016
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Released: 2016-11-30
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249.60 EUR
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24.96 EUR
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74.88 EUR
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249.60 EUR
BS EN 60749-9:2017
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Released: 2017-11-27
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151.20 EUR
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15.12 EUR
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45.36 EUR
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BS EN 60749-34:2010
Semiconductor devices. Mechanical and climatic test methods Power cycling
Semiconductor devices. Mechanical and climatic test methods Power cycling
Released: 2011-02-28
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151.20 EUR
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15.12 EUR
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45.36 EUR
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151.20 EUR