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31.080.01 Semiconductor devices in general
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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Released: 2022-08-16
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191.18 EUR
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19.12 EUR
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Reading the standardfor 24 hours
57.35 EUR
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191.18 EUR
BS EN IEC 60749-37:2022 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Released: 2022-12-20
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372.68 EUR
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372.68 EUR
23/30477062 DC
BS EN IEC 62007-2. Semiconductor optoelectronic devices for fibre optic system applications Part 2. Measuring methods
BS EN IEC 62007-2. Semiconductor optoelectronic devices for fibre optic system applications Part 2. Measuring methods
Released: 2023-07-20
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24.20 EUR
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24.20 EUR
24/30497546 DC
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
Released: 2024-09-06
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24.20 EUR
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24.20 EUR
24/30497538 DC
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement and the analysis of other residual gases
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement and the analysis of other residual gases
Released: 2024-09-06
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24.20 EUR
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24.20 EUR
24/30497542 DC
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
Released: 2024-09-06
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24.20 EUR
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24.20 EUR
BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Released: 2024-10-29
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191.18 EUR
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19.12 EUR
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Reading the standardfor 24 hours
57.35 EUR
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191.18 EUR
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162.14 EUR
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16.21 EUR
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48.64 EUR
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162.14 EUR
BS EN 62007-2:2009
Semiconductor optoelectronic devices for fibre optic system applications Measuring methods
Semiconductor optoelectronic devices for fibre optic system applications Measuring methods
Released: 2009-10-31
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312.18 EUR
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31.22 EUR
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93.65 EUR
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312.18 EUR
BS 7241:1989
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
Released: 1990-03-30
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399.30 EUR
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39.93 EUR
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119.79 EUR
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399.30 EUR
BS EN 60749-24:2004
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Released: 2004-06-24
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162.14 EUR
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16.21 EUR
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48.64 EUR
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162.14 EUR
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266.20 EUR
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Reading the standardfor 1 hour
26.62 EUR
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Reading the standardfor 24 hours
79.86 EUR
English Hardcopy
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266.20 EUR