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31.080.01 Semiconductor devices in general
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BS EN 60749-31:2003
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Released: 2003-07-04
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154.10 EUR
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154.10 EUR
PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Released: 2001-12-05
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Released: 2007-07-31
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BS EN 60749-23:2004+A1:2011
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Released: 2011-06-30
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BS EN 60749-27:2006+A1:2012
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Released: 2013-01-31
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181.70 EUR
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BS EN 60749-21:2011
Semiconductor devices. Mechanical and climatic test methods Solderability
Semiconductor devices. Mechanical and climatic test methods Solderability
Released: 2011-08-31
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253.00 EUR
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253.00 EUR
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181.70 EUR
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BS IEC 62779-4:2020
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Released: 2020-07-17
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BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Released: 2020-10-01
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BS EN IEC 60749-30:2020
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Released: 2020-09-30
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181.70 EUR
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23.00 EUR
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23.00 EUR
BS EN IEC 60749-37:2022
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Released: 2022-11-22
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253.00 EUR
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