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31.080.01 Semiconductor devices in general
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24/30497538 DC
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement and the analysis of other residual gases
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement and the analysis of other residual gases
Released: 2024-09-06
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24/30497542 DC
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
Released: 2024-09-06
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BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Released: 2024-10-29
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181.70 EUR
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24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
Released: 2024-12-13
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BS EN 60068-2-77:1999
Environmental testing. Test methods Body strength and impact shock
Environmental testing. Test methods Body strength and impact shock
Released: 1999-09-15
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BS EN 60749-19:2003+A1:2010
Semiconductor devices. Mechanical and climatic test methods Die shear strength
Semiconductor devices. Mechanical and climatic test methods Die shear strength
Released: 2010-10-31
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154.10 EUR
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BS EN 60191-3:2000
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
Released: 2000-06-15
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351.90 EUR
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351.90 EUR
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154.10 EUR
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154.10 EUR
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253.00 EUR
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253.00 EUR
BS EN 60749-22:2003
Semiconductor devices. Mechanical and climatic test methods Bond strength
Semiconductor devices. Mechanical and climatic test methods Bond strength
Released: 2003-07-04
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BS IEC 62047-29:2017
Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
Released: 2018-03-15
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181.70 EUR
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