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24/30499096 DC
BS EN IEC 63602 Guidelines for Representing Switching Losses of SIC MOSFETs in Datasheets (Fast track)
BS EN IEC 63602 Guidelines for Representing Switching Losses of SIC MOSFETs in Datasheets (Fast track)
Released: 2024-10-04
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24/30500231 DC
BS EN IEC 63550-3 Semiconductor devices. Neuromorphic devices Part 3. Evaluation method of spike dependent plasticity in memristor devices
BS EN IEC 63550-3 Semiconductor devices. Neuromorphic devices Part 3. Evaluation method of spike dependent plasticity in memristor devices
Released: 2024-09-13
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BS EN 62258-5:2006
Semiconductor die products Requirements for information concerning electrical simulation
Semiconductor die products Requirements for information concerning electrical simulation
Released: 2006-11-30
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18.00 EUR
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54.00 EUR
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180.00 EUR
BS EN 62047-12:2011
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Released: 2011-11-30
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87.84 EUR
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BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Released: 2011-06-30
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PD IEC/TR 62258-8:2008
Semiconductor die products EXPRESS model schema for data exchange
Semiconductor die products EXPRESS model schema for data exchange
Released: 2008-09-30
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BS EN 62258-2:2011
Semiconductor die products Exchange data formats
Semiconductor die products Exchange data formats
Released: 2011-07-31
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376.80 EUR
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113.04 EUR
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PD CLC/TR 62258-4:2013
Semiconductor die products Questionnaire for die users and suppliers
Semiconductor die products Questionnaire for die users and suppliers
Released: 2014-11-30
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BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Released: 2019-04-17
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Released: 2019-04-18
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BS IEC 62047-34:2019
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Released: 2019-04-16
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