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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2017-09-25
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264.00 EUR
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26.40 EUR
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79.20 EUR
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264.00 EUR
BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-07-31
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264.00 EUR
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26.40 EUR
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79.20 EUR
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264.00 EUR
PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Released: 2014-05-07
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396.00 EUR
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39.60 EUR
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Reading the standardfor 24 hours
118.80 EUR
English Hardcopy
In stock
396.00 EUR
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264.00 EUR
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26.40 EUR
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79.20 EUR
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264.00 EUR
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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189.60 EUR
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18.96 EUR
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56.88 EUR
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189.60 EUR
PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Released: 2015-12-16
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189.60 EUR
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18.96 EUR
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56.88 EUR
English Hardcopy
In stock
189.60 EUR
English Secure PDF
Immediate download
189.60 EUR
You can read the standard for 1 hour. More information in the category: E-reading
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18.96 EUR
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56.88 EUR
English Hardcopy
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189.60 EUR
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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264.00 EUR
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26.40 EUR
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79.20 EUR
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264.00 EUR
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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309.60 EUR
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30.96 EUR
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92.88 EUR
English Hardcopy
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309.60 EUR
English Secure PDF
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189.60 EUR
You can read the standard for 1 hour. More information in the category: E-reading
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18.96 EUR
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standardfor 24 hours
56.88 EUR
English Hardcopy
In stock
189.60 EUR
English Secure PDF
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189.60 EUR
You can read the standard for 1 hour. More information in the category: E-reading
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18.96 EUR
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56.88 EUR
English Hardcopy
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189.60 EUR
BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Released: 1998-08-15
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309.60 EUR
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30.96 EUR
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Reading the standardfor 24 hours
92.88 EUR
English Hardcopy
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309.60 EUR