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31.180 Printed circuits and boards

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BS EN 61249-3-4:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyimide film

Released: 1999-06-15

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56.88 EUR

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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad

Released: 2006-07-31

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79.20 EUR

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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Released: 2014-05-07

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118.80 EUR

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BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

Released: 2015-06-30

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology

Released: 2015-04-30

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BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Released: 2013-04-30

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BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Released: 2013-04-30

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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2014-02-28

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PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines

Released: 2017-03-31

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BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description

Released: 2012-08-31

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BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2009-10-31

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BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2009-10-31

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189.60 EUR

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56.88 EUR

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189.60 EUR

257 results

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