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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...91113...202122Last page
BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
Released: 2001-12-17
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253.00 EUR
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253.00 EUR
BS EN 62326-1:2002
Printed boards Generic specification
Released: 2002-08-16
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351.90 EUR
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351.90 EUR
BS 123000:2001
System of quality assessment. Generic specification. Printed boards
Released: 2001-12-17
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296.70 EUR
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296.70 EUR
BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Released: 2016-04-30
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181.70 EUR
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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Released: 2019-01-03
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351.90 EUR
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351.90 EUR
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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181.70 EUR
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181.70 EUR
BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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181.70 EUR
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181.70 EUR
BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
Released: 1982-01-29
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253.00 EUR
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253.00 EUR
BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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253.00 EUR
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BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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253.00 EUR
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253.00 EUR
BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2014-02-28
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181.70 EUR
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PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Released: 2017-03-31
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253.00 EUR
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253.00 EUR
256 results
First page123...91113...202122Last page