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31.180 Printed circuits and boards

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology

Released: 2015-04-30

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87.84 EUR

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292.80 EUR

BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2009-10-31

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54.00 EUR

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180.00 EUR

BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers

Released: 2019-06-07

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249.60 EUR

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24.96 EUR

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74.88 EUR

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BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2013-04-30

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24.96 EUR

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74.88 EUR

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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards

Released: 2001-12-17

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87.84 EUR

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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections

Released: 2001-12-17

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BS 123000:2001
System of quality assessment. Generic specification. Printed boards

Released: 2001-12-17

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BS EN 62326-1:2002
Printed boards Generic specification

Released: 2002-08-16

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348.00 EUR

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34.80 EUR

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104.40 EUR

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BS EN 61249-3-5:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Transfer adhesive films for flexible printed boards

Released: 1999-06-15

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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies

Released: 2017-09-25

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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities

Released: 1998-08-15

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BS EN 61249-2-13:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Released: 1999-06-15

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