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31.180 Printed circuits and boards

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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

Released: 1990-02-28

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162.14 EUR

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16.21 EUR

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48.64 EUR

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162.14 EUR

BS CECC 23300-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

Released: 1996-04-15

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312.18 EUR

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31.22 EUR

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93.65 EUR

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312.18 EUR

BS CECC 23700-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections

Released: 1998-06-15

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191.18 EUR

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19.12 EUR

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57.35 EUR

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191.18 EUR

BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies

Released: 2002-05-14

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266.20 EUR

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79.86 EUR

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PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide

Released: 2015-04-30

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79.86 EUR

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BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method

Released: 2019-01-23

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BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards

Released: 2019-07-19

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399.30 EUR

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119.79 EUR

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BS 6221-1:1990
Printed wiring boards Guide for the specification writer

Released: 1990-02-28

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BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Released: 2003-08-14

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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2018-04-16

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BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2018-04-13

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79.86 EUR

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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Released: 2021-03-19

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350.90 EUR

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105.27 EUR

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254 results

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