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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
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BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
Released: 2012-08-31
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333.50 EUR
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333.50 EUR
BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2005-10-07
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253.00 EUR
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253.00 EUR
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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181.70 EUR
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181.70 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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253.00 EUR
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253.00 EUR
BS EN 61249-2-18:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper clad
Released: 2002-05-10
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253.00 EUR
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253.00 EUR
PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Released: 2015-12-16
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181.70 EUR
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181.70 EUR
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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181.70 EUR
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181.70 EUR
BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
Released: 2021-11-05
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154.10 EUR
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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181.70 EUR
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181.70 EUR
BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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181.70 EUR
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181.70 EUR
23/30477815 DC
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation for printed electronics
Released: 2023-08-02
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23.00 EUR
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23.00 EUR
BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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253.00 EUR
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253.00 EUR
256 results
First page123...101214...202122Last page