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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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249.60 EUR
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24.96 EUR
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Reading the standardfor 24 hours
74.88 EUR
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In stock
249.60 EUR
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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292.80 EUR
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29.28 EUR
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87.84 EUR
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292.80 EUR
PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Released: 2014-05-07
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376.80 EUR
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37.68 EUR
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113.04 EUR
English Hardcopy
In stock
376.80 EUR
English Secure PDF
Immediate download
249.60 EUR
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standardfor 1 hour
24.96 EUR
You can read the standard for 24 hours. More information in the category: E-reading
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74.88 EUR
English Hardcopy
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249.60 EUR
BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-07-31
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249.60 EUR
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24.96 EUR
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74.88 EUR
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249.60 EUR
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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180.00 EUR
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18.00 EUR
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54.00 EUR
English Hardcopy
In stock
180.00 EUR
English Secure PDF
Immediate download
180.00 EUR
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standardfor 1 hour
18.00 EUR
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54.00 EUR
English Hardcopy
In stock
180.00 EUR
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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180.00 EUR
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18.00 EUR
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54.00 EUR
English Hardcopy
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180.00 EUR
English Secure PDF
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151.20 EUR
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15.12 EUR
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45.36 EUR
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151.20 EUR
BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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180.00 EUR
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18.00 EUR
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54.00 EUR
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180.00 EUR
English Secure PDF
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24.00 EUR
English Hardcopy
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24.00 EUR
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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180.00 EUR
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18.00 EUR
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54.00 EUR
English Hardcopy
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180.00 EUR