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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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254 results
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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21/30441791 DC
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
Released: 2021-07-30
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Released: 1990-12-31
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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Released: 2019-05-13
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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2005-08-24
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BS IEC 62899-401:2017
Printed electronics Printability. Overview
Released: 2017-03-31
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BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-06-30
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Released: 2007-10-31
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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
Released: 2002-05-02
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254 results
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