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31.180 Printed circuits and boards
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Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
BS 123800:2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
Released: 2001-12-17
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296.70 EUR
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296.70 EUR
BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Released: 2001-12-17
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181.70 EUR
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181.70 EUR
BS 123500:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
Released: 2001-12-17
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181.70 EUR
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181.70 EUR
English Secure PDF
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253.00 EUR
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253.00 EUR
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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379.50 EUR
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379.50 EUR
English Secure PDF
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253.00 EUR
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In stock
253.00 EUR
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253.00 EUR
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253.00 EUR
BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Released: 2021-04-22
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181.70 EUR
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181.70 EUR
BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Released: 2022-04-06
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154.10 EUR
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154.10 EUR
English Secure PDF
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181.70 EUR
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181.70 EUR
English Secure PDF
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253.00 EUR
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253.00 EUR
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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181.70 EUR
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181.70 EUR