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31.180 Printed circuits and boards

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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2018-04-16

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79.20 EUR

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BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2018-04-13

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BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies

Released: 2016-10-31

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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides

Released: 2007-12-31

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56.88 EUR

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BS 6221-1:1990
Printed wiring boards Guide for the specification writer

Released: 1990-02-28

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160.80 EUR

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160.80 EUR

BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Released: 2003-08-14

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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

Released: 2010-05-31

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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections

Released: 2001-12-17

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BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections

Released: 1991-12-20

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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes

Released: 2001-12-17

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BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards

Released: 1989-08-31

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BS EN 61249-2-12:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad

Released: 1999-06-15

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257 results

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