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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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255 results
First page123...151719202122Last page
20/30394594 DC
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element
Released: 2020-12-04
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BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Released: 2023-06-08
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21/30441791 DC
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
Released: 2021-07-30
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
Released: 2021-03-18
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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Released: 2021-12-24
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24/30491008 DC
BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures Part 3-6. Sectional specification set for unreinforced base materials, clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2024-04-10
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24/30491435 DC
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
Released: 2024-04-12
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Released: 2014-10-31
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BS EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures
Released: 2006-11-30
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255 results
First page123...151719202122Last page