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31.180 Printed circuits and boards

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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates

Released: 2019-01-03

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110.16 EUR

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367.20 EUR

BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Released: 2005-10-07

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79.20 EUR

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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks

Released: 1997-05-15

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189.60 EUR

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18.96 EUR

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56.88 EUR

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BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers

Released: 2019-06-07

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology

Released: 2015-04-30

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309.60 EUR

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92.88 EUR

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BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Released: 2016-04-30

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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards

Released: 2001-12-17

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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections

Released: 2001-12-17

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BS EN 62326-1:2002
Printed boards Generic specification

Released: 2002-08-16

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BS EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability

Released: 2006-02-01

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189.60 EUR

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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2009-04-30

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BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides

Released: 2007-12-31

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