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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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178.50 EUR
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Reading the standardfor 1 hour
17.85 EUR
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Reading the standardfor 24 hours
53.55 EUR
English Hardcopy
In stock
178.50 EUR
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247.52 EUR
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24.75 EUR
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standardfor 24 hours
74.26 EUR
English Hardcopy
In stock
247.52 EUR
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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373.66 EUR
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37.37 EUR
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112.10 EUR
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In stock
373.66 EUR
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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290.36 EUR
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29.04 EUR
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Reading the standardfor 24 hours
87.11 EUR
English Hardcopy
In stock
290.36 EUR
English Secure PDF
Immediate download
373.66 EUR
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standardfor 1 hour
37.37 EUR
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Reading the standardfor 24 hours
112.10 EUR
English Hardcopy
In stock
373.66 EUR
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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178.50 EUR
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17.85 EUR
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53.55 EUR
English Hardcopy
In stock
178.50 EUR
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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178.50 EUR
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17.85 EUR
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53.55 EUR
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178.50 EUR
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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178.50 EUR
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17.85 EUR
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53.55 EUR
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178.50 EUR
PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Released: 2021-10-29
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178.50 EUR
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17.85 EUR
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53.55 EUR
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178.50 EUR
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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149.94 EUR
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14.99 EUR
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44.98 EUR
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149.94 EUR
PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Released: 2014-10-31
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373.66 EUR
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37.37 EUR
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Reading the standardfor 24 hours
112.10 EUR
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373.66 EUR
PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
Qualification and performance of electrical insulating compound for printed wiring assemblies
Released: 2014-06-30
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247.52 EUR
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standardfor 1 hour
24.75 EUR
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standardfor 24 hours
74.26 EUR
English Hardcopy
In stock
247.52 EUR