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31.180 Printed circuits and boards

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BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides

Released: 2007-12-31

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BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2009-06-30

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BS IEC 62899-401:2017
Printed electronics Printability. Overview

Released: 2017-03-31

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BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability

Released: 2006-02-01

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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Released: 2007-10-31

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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad

Released: 2002-05-02

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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates

Released: 2019-12-17

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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)

Released: 2021-12-24

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21/30441791 DC
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

Released: 2021-07-30

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Released: 2021-08-20

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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices

Released: 2021-03-25

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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies

Released: 2021-03-18

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257 results

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