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31.180 Printed circuits and boards

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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

Released: 2018-04-13

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BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Released: 2018-04-18

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BS 123400-003:2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections

Released: 2001-12-17

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20/30394594 DC
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element

Released: 2020-12-04

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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)

Released: 2021-12-24

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21/30441791 DC
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

Released: 2021-07-30

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Released: 2021-08-20

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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices

Released: 2021-03-25

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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies

Released: 2021-03-18

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BS CECC 23200-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes

Released: 1996-04-15

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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2009-10-31

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BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2009-10-31

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19.12 EUR

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254 results

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