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31.180 Printed circuits and boards

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BS EN 61249-2-4:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

Released: 2002-05-08

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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods

Released: 2015-07-31

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34.80 EUR

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104.40 EUR

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19/30379185 DC
BS EN 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test methods of wrist worn wearable electronic devices for measuring skin contact temperature

Released: 2019-01-31

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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance

Released: 1998-12-15

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87.84 EUR

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PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Released: 2019-07-18

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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards

Released: 2001-12-17

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BS 123500:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections

Released: 2001-12-17

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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies

Released: 2020-03-23

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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image

Released: 2021-04-22

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Released: 2021-03-19

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes

Released: 2021-03-12

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries

Released: 2022-08-23

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