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31.180 Printed circuits and boards

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BS EN 61189-5-3:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies

Released: 2015-04-30

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104.40 EUR

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BS EN 61249-3-3:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyester film

Released: 1999-06-15

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BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Copper foils (for the manufacture of copper-clad base materials)

Released: 1996-09-15

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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad

Released: 2006-06-30

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BS EN 61249-8-7:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks

Released: 1997-03-15

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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Released: 2007-07-31

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BS EN 61754-20-100:2012
Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces Interface standard for LC connectors with protective housings related to IEC 61076-3-106

Released: 2012-09-30

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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image

Released: 2021-04-22

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Released: 2021-03-19

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes

Released: 2021-03-12

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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies

Released: 2020-03-23

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BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin (IEC 63203-406-1:2021)

Released: 2022-05-10

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257 results

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