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31.180 Printed circuits and boards

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BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description

Released: 2012-08-31

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104.40 EUR

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348.00 EUR

BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2009-10-31

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56.88 EUR

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BS 123000:2001
System of quality assessment. Generic specification. Printed boards

Released: 2001-12-17

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92.88 EUR

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BS EN 62326-20:2016
Printed boards Printed circuit boards for high-brightness LEDs

Released: 2016-05-31

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110.16 EUR

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21/30431274 DC
BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design and use Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)

Released: 2021-01-06

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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library

Released: 2021-01-22

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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

Released: 2021-11-05

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BS EN IEC 63203-402-1:2022
Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods of glove-type motion sensors for measuring finger movements

Released: 2023-01-20

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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits

Released: 2023-01-26

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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method

Released: 2021-03-11

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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate

Released: 2021-07-29

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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer

Released: 2023-08-23

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