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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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254 results
First page124678...202122Last page
BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Released: 2007-10-31
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79.86 EUR
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BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-06-30
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26.62 EUR
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BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Released: 1990-12-31
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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
Released: 2002-05-02
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BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
Released: 2007-12-31
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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24/30491008 DC
BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures Part 3-6. Sectional specification set for unreinforced base materials, clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2024-04-10
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24/30491435 DC
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
Released: 2024-04-12
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BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Released: 2023-06-08
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438.02 EUR
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254 results
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