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31.180 Printed circuits and boards
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BS IEC 62899-202:2023
Printed electronics Materials. Conductive ink
Printed electronics Materials. Conductive ink
Released: 2023-05-25
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296.70 EUR
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296.70 EUR
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23.00 EUR
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23.00 EUR
23/30474639 DC
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
Released: 2023-06-02
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23.00 EUR
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23.00 EUR
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181.70 EUR
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181.70 EUR
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181.70 EUR
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181.70 EUR
BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Released: 1998-08-15
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296.70 EUR
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181.70 EUR
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181.70 EUR
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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253.00 EUR
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253.00 EUR
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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296.70 EUR
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296.70 EUR
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181.70 EUR
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181.70 EUR
BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2017-09-25
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253.00 EUR
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253.00 EUR
BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-07-31
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253.00 EUR
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253.00 EUR