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31.180 Printed circuits and boards

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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections

Released: 2001-12-17

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309.60 EUR

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92.88 EUR

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309.60 EUR

BS 123700:2001
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections

Released: 2001-12-17

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79.20 EUR

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BS 123100:2001
System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes

Released: 2001-12-17

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160.80 EUR

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16.08 EUR

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48.24 EUR

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160.80 EUR

PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies

Released: 2020-03-23

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396.00 EUR

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118.80 EUR

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Released: 2021-03-19

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes

Released: 2021-03-12

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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image

Released: 2021-04-22

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries

Released: 2022-08-23

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BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates

Released: 2022-04-06

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BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin (IEC 63203-406-1:2021)

Released: 2022-05-10

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56.88 EUR

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BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Released: 2022-05-06

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BS EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures Sectional specification set for reinforcement materials. Specification for finished fabric woven from "E" glass for printed boards

Released: 2023-08-08

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79.20 EUR

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