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31.190 Electronic component assemblies
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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Released: 2019-10-07
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349.06 USD
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349.06 USD
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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349.06 USD
12/30262664 DC
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
Released: 2012-04-04
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27.06 USD
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27.06 USD
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414.00 USD
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414.00 USD
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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297.65 USD
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297.65 USD
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Released: 2014-06-30
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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Released: 2012-03-31
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392.35 USD
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392.35 USD
BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Released: 2007-12-31
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213.76 USD
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213.76 USD
BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Released: 2003-10-16
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414.00 USD
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414.00 USD
BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Released: 2009-03-31
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213.76 USD
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213.76 USD
BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2019-07-12
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349.06 USD
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349.06 USD