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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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191.18 EUR
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19.12 EUR
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57.35 EUR
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191.18 EUR
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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312.18 EUR
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31.22 EUR
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93.65 EUR
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312.18 EUR
BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Released: 2007-10-31
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191.18 EUR
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19.12 EUR
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57.35 EUR
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191.18 EUR
BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Released: 2009-03-31
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266.20 EUR
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26.62 EUR
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79.86 EUR
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266.20 EUR
DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Released: 2008-10-31
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191.18 EUR
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19.12 EUR
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57.35 EUR
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191.18 EUR
BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Released: 2007-10-31
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191.18 EUR
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19.12 EUR
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57.35 EUR
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191.18 EUR
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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266.20 EUR
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26.62 EUR
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79.86 EUR
English Hardcopy
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266.20 EUR
English Secure PDF
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370.26 EUR
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37.03 EUR
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111.08 EUR
English Hardcopy
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370.26 EUR
PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Released: 2024-02-07
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266.20 EUR
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26.62 EUR
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79.86 EUR
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266.20 EUR
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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162.14 EUR
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16.21 EUR
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48.64 EUR
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162.14 EUR
BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Released: 2023-12-05
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266.20 EUR
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26.62 EUR
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79.86 EUR
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266.20 EUR
24/30498340 DC
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
Released: 2024-08-02
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24.20 EUR
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24.20 EUR