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Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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80 results
First page13567Last page
23/30480020 DC
BS EN IEC 60068-2-88. Environmental Testing Part 2-88. Tests. Test XD. Resistance of components and assemblies to liquid cleaning media
Released: 2023-09-20
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23.00 EUR
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23.00 EUR
PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Released: 2022-10-31
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253.00 EUR
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PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Released: 2024-04-08
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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Released: 2024-10-18
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23.00 EUR
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Released: 1998-12-15
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296.70 EUR
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Released: 2021-03-19
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253.00 EUR
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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379.50 EUR
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379.50 EUR
BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2020-02-27
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466.90 EUR
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BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2020-02-24
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416.30 EUR
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21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Released: 2021-12-03
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BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Released: 2002-08-16
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253.00 EUR
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253.00 EUR
BS EN 62421:2007
Electronics assembly technology. Electronic modules
Released: 2007-12-31
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181.70 EUR
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181.70 EUR
80 results
First page13567Last page