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181.70 EUR
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181.70 EUR
BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Released: 2020-06-16
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296.70 EUR
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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Device embedded substrate Generic specification. Test methods
Released: 2015-07-31
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351.90 EUR
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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Released: 2013-09-30
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Released: 2013-06-30
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Released: 1997-12-15
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154.10 EUR
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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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333.50 EUR
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333.50 EUR
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181.70 EUR
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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Released: 2006-09-29
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379.50 EUR
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379.50 EUR
BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Product package labels for electronic components using bar code and two- dimensional symbologies
Released: 2017-07-31
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BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Released: 2011-07-31
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