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BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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181.70 EUR
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181.70 EUR
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Released: 2019-11-18
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351.90 EUR
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351.90 EUR
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333.50 EUR
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333.50 EUR
PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Released: 2022-09-13
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379.50 EUR
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379.50 EUR
BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Released: 2021-09-13
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333.50 EUR
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333.50 EUR
English Secure PDF
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379.50 EUR
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379.50 EUR
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23.00 EUR
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23.00 EUR
BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Released: 2007-10-31
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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Released: 2007-10-31
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181.70 EUR
BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Released: 2009-03-31
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253.00 EUR
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253.00 EUR
DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Released: 2008-10-31
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181.70 EUR
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181.70 EUR
PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Device embedded substrate Guidelines. Electrical testing
Released: 2015-12-31
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181.70 EUR
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181.70 EUR