Log inSign up
LANGUAGE en
Menu
STOREE-ReadingHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-17 - Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Sponsored link
Released: 01.12.2011
CSN EN 60191-6-17 - Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

CSN EN 60191-6-17

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Format
Availability
Price and currency
English Hardcopy
In stock
84.00 EUR
FREE Shipping
Number of Standard:CSN EN 60191-6-17
Category:358791
Pages:40
Released:01.12.2011
Catalog number:89571
DESCRIPTION

CSN EN 60191-6-17

CSN EN 60191-6-17 Tato norma poskytuje společné výkresy a rozměry pro vrstvená pouzdra a pro samostatná pouzdra, které je možno vrstvit v provedení FBGA nebo FLGA.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
Print