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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-20 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)
Released: 01.06.2011
CSN EN 60191-6-20 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)

CSN EN 60191-6-20

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)

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Number of Standard:CSN EN 60191-6-20
Category:358791
Pages:32
Released:01.06.2011
Catalog number:88329
DESCRIPTION

CSN EN 60191-6-20


Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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