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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-21 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)
Released: 01.06.2011
CSN EN 60191-6-21 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)

CSN EN 60191-6-21

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)

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Number of Standard:CSN EN 60191-6-21
Category:358791
Pages:40
Released:01.06.2011
Catalog number:88328
DESCRIPTION

CSN EN 60191-6-21


Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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