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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-22 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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Released: 01.09.2013
CSN EN 60191-6-22 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

CSN EN 60191-6-22

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

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Number of Standard:CSN EN 60191-6-22
Category:358791
Pages:28
Released:01.09.2013
Catalog number:93689
DESCRIPTION

CSN EN 60191-6-22

CSN EN 60191-6-22 Tato norma poskytuje normované výkresy s rozměry, které jsou společné pouzdřeným strukturám s křemíkovým čipem pro pouzdra s polem kuličkových vývodů (BGA) a pouzdra s plošným polem vývodů (LGA).
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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