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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-4 - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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Released: 01.01.2004
CSN EN 60191-6-4 - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

CSN EN 60191-6-4

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

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Number of Standard:CSN EN 60191-6-4
Category:358791
Pages:24
Released:01.01.2004
Catalog number:69427
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CSN EN 60191-6-4


Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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