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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN 61189-2-721 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
Released: 01.12.2015
CSN EN 61189-2-721 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

CSN EN 61189-2-721

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

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Number of Standard:CSN EN 61189-2-721
Category:359039
Pages:32
Released:01.12.2015
Catalog number:98353
DESCRIPTION

CSN EN 61189-2-721

CSN EN 61189-2-721 This part of IEC 61189 outlines a way to determine the relative permittivity ( r) and loss tangent (tan ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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