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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61188-6-2 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
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Released: 01.08.2021
CSN EN IEC 61188-6-2 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

CSN EN IEC 61188-6-2

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

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Number of Standard:CSN EN IEC 61188-6-2
Category:359038
Pages:36
Released:01.08.2021
Catalog number:512552
DESCRIPTION

CSN EN IEC 61188-6-2

CSN EN IEC 61188-6-2 This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191 2:2017..
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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