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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
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Released: 01.09.2022
CSN EN IEC 61189-2-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

CSN EN IEC 61189-2-501

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

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Number of Standard:CSN EN IEC 61189-2-501
Category:359039
Pages:24
Released:01.09.2022
Catalog number:514956
DESCRIPTION

CSN EN IEC 61189-2-501

CSN EN IEC 61189-2-501 This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN..
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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