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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-803 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
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Released: 01.02.2024
CSN EN IEC 61189-2-803 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

CSN EN IEC 61189-2-803

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

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Number of Standard:CSN EN IEC 61189-2-803
Category:359039
Pages:20
Released:01.02.2024
Catalog number:518366
DESCRIPTION

CSN EN IEC 61189-2-803

CSN EN IEC 61189-2-803 This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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