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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-804 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

CSN EN IEC 61189-2-804

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

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Number of Standard:	CSN EN IEC 61189-2-804
Category:	359039
Pages:	20
Released:	01.02.2024
Catalog number:	518419

DESCRIPTION

CSN EN IEC 61189-2-804

CSN EN IEC 61189-2-804 This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.

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