Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-804 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Released: 01.02.2024
CSN EN IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
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Number of Standard:
CSN EN IEC 61189-2-804
Category:
359039
Pages:
20
Released:
01.02.2024
Catalog number:
518419
DESCRIPTION
CSN EN IEC 61189-2-804
CSN EN IEC 61189-2-804 This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values. Original English text of CSN EN Standard. The price of the Standard included all amendments and correcturs.
