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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-807 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
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Released: 01.03.2022
CSN EN IEC 61189-2-807 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

CSN EN IEC 61189-2-807

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

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Number of Standard:CSN EN IEC 61189-2-807
Category:359039
Pages:20
Released:01.03.2022
Catalog number:513935
DESCRIPTION

CSN EN IEC 61189-2-807

CSN EN IEC 61189-2-807 This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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