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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-808 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

CSN EN IEC 61189-2-808

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

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Number of Standard:	CSN EN IEC 61189-2-808
Category:	359039
Pages:	32
Released:	01.10.2024
Catalog number:	520035

DESCRIPTION

CSN EN IEC 61189-2-808

CSN EN IEC 61189-2-808 This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE - This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.

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