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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN IEC 62878-2-602 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity
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Released: 01.01.2022
CSN EN IEC 62878-2-602 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity

CSN EN IEC 62878-2-602

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity

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Number of Standard:CSN EN IEC 62878-2-602
Category:359378
Pages:24
Released:01.01.2022
Catalog number:513471
DESCRIPTION

CSN EN IEC 62878-2-602

CSN EN IEC 62878-2-602 High-end servers, network systems and smart phones have been driving the electronic assembly technologies for the last couple of decades. Any applications to enable the "Internet of Things" (aka IoT) require new electronic assembly technologies to achieve small size, low energy consumption and robust security in a cost-effective way. This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.