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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 63251 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
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Released: 01.05.2024
CSN EN IEC 63251 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

CSN EN IEC 63251

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

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Number of Standard:CSN EN IEC 63251
Category:359040
Pages:32
Released:01.05.2024
Catalog number:518903
DESCRIPTION

CSN EN IEC 63251

CSN EN IEC 63251 This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.