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CSN EN 60749-35
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Released: 01.05.2007
English Hardcopy
In stock
92.00 EUR
CSN EN 62047-18
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Released: 01.04.2014
English Hardcopy
In stock
61.00 EUR
CSN EN 62215-3
Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
Released: 01.04.2014
English Hardcopy
In stock
84.00 EUR
CSN EN 61988-3-2
Plasma display panels - Part 3-2: Interface - Electrical interface
Plasma display panels - Part 3-2: Interface - Electrical interface
Released: 01.04.2010
English Hardcopy
In stock
69.00 EUR
CSN EN 61988-5
Plasma display panels - Part 5: Generic specification
Plasma display panels - Part 5: Generic specification
Released: 01.06.2010
English Hardcopy
In stock
69.00 EUR
English Hardcopy
In stock
84.00 EUR
CSN EN 60749-34 ed. 2
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Released: 01.09.2011
English Hardcopy
In stock
61.00 EUR
CSN EN 60749-29 ed. 2
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
Released: 01.12.2011
English Hardcopy
In stock
69.00 EUR
CSN EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Released: 01.03.2012
English Hardcopy
In stock
69.00 EUR
CSN EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Released: 01.03.2012
English Hardcopy
In stock
69.00 EUR
CSN EN 61988-2-4
Plasma display panels - Part 2-4: Measuring methods - Visual quality - Image artifacts
Plasma display panels - Part 2-4: Measuring methods - Visual quality - Image artifacts
Released: 01.05.2012
English Hardcopy
In stock
84.00 EUR
CSN EN 61747-30-1
Liquid crystal display devices - Part 30-1: Measuring methods for liquid crystal display modules - Transmissive type
Liquid crystal display devices - Part 30-1: Measuring methods for liquid crystal display modules - Transmissive type
Released: 01.03.2013
English Hardcopy
In stock
92.00 EUR