Log inSign up
LANGUAGE en
Menu
STOREE-ReadingHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring

3590 Printed wiring

CURRENCY
PRICES include / exclude VAT
Price include VAT will be charged for customers of European Union – non VAT payers.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
76 results
First page124567Last page
CSN EN 61249-2-37
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008)
Released: 01.09.2009
English Hardcopy
In stock
92.00 EUR
CSN EN 61249-2-36
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008)
Released: 01.09.2009
English Hardcopy
In stock
92.00 EUR
CSN EN IEC 61189-2-720
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
Released: 01.09.2024
English Hardcopy
In stock
52.00 EUR
CSN EN 61249-2-39
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 01.06.2013
English Hardcopy
In stock
69.00 EUR
CSN EN 61249-4-18
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 01.06.2014
English Hardcopy
In stock
61.00 EUR
CSN EN 61249-2-43
Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 01.11.2016
English Hardcopy
In stock
69.00 EUR
CSN EN 61189-2-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
Released: 01.02.2017
English Hardcopy
In stock
69.00 EUR
CSN EN 61188-5-3
Printed boards and printed board assemblies - Design and use - Part 5 - 3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
Released: 01.04.2008
English Hardcopy
In stock
84.00 EUR
CSN EN 61188-5-5
Printed boards and printed board assemblies - Design and use - Part 5 - 5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
Released: 01.04.2008
English Hardcopy
In stock
92.00 EUR
CSN EN 61249-4-15
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 01.12.2009
English Hardcopy
In stock
61.00 EUR
CSN EN 61189-5-2
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Released: 01.08.2015
English Hardcopy
In stock
92.00 EUR
CSN EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Released: 01.11.2010
English Hardcopy
In stock
84.00 EUR
76 results
First page124567Last page